Development of low dielectric and high thermal insulation materials using polyimide porous bodies.
The power of porous materials advances communication! Communication materials made from polyimide porous bodies.
Our company is engaged in the development of low dielectric and high thermal insulation materials using "polyimide porous bodies." Through the development of low dielectric materials with high flexibility and heat resistance, we achieve low dielectric constant and high thermal insulation (low thermal conductivity) with the nanosized porous structure of polyimide (PI). We can respond on demand to considerations for porosity tailored to your resin materials. 【Features】 ■ Achieves low dielectric constant and high thermal insulation (low thermal conductivity) ■ Retains the heat resistance, flame retardancy, and chemical resistance of polyimide ■ Maintains flexibility while achieving a high porosity ■ Freeze-drying method (atmospheric pressure drying method can also be considered) *For more details, please refer to the PDF materials or feel free to contact us.
- 企業：KRI
- 価格：Other
